1. Micro-Electro-Mechanical Systems (MEMS) In MEMS applications, organopolysilazane is used to manufacture ceramic fibers and porous ceramic materials. These materials meet the high material requirements of MEMS devices due to their excellent mechanical properties and chemical stability. Additionally, the adjustable curing time and diverse curing methods of organopolysilazane provide great flexibility in the manufacturing of MEMS devices.
2. Integrated Circuit Insulation Layers The low dielectric constant and high thermal conductivity of organopolysilazane make it an ideal insulating material for integrated circuits. It can effectively reduce signal delay and enhance the performance and reliability of integrated circuits. As semiconductor technology progresses towards higher performance and smaller dimensions, the application prospects of this material are becoming increasingly broad.
3. Photovoltaic Cells In the photovoltaic cell field, organopolysilazane is used to fabricate optical waveguides and optical fibers, among other devices, to improve the performance and stability of optical components. Moreover, its high-temperature resistance and corrosion resistance make it an important material in the manufacturing of photovoltaic cells.

Summary Organopolysilazane, with its excellent insulation, thermal stability, and mechanical properties, has a wide range of applications in semiconductor devices, particularly in the fields of chip packaging, silicon nitride film deposition, high-temperature coatings, MEMS, and integrated circuit insulation layers. As technology continues to advance, its application scope and significance in the semiconductor industry are expected to expand further.