How to Improve the Corrosion Resistance of Organic Polysilazane in Chip Packaging-IOTA

How to Improve the Corrosion Resistance of Organic Polysilazane in Chip Packaging

Hits: 284 img

Here are some methods to enhance the corrosion resistance of organic polysilazane in chip packaging:

Precisely control reaction conditions: During the synthesis of organic polysilazane, precisely control parameters such as reaction temperature, time, and reactant ratios to obtain a polymer with a uniform molecular - weight distribution and regular structure. For example, moderately increasing the reaction temperature can promote the formation of silicon - nitrogen bonds, but an excessively high temperature may lead to over - crosslinking of the polymer and affect its performance.
Introduce special functional groups: Introduce functional groups with corrosion resistance, such as fluorine atoms and phenyl groups, into the molecular structure. Fluorine atoms have strong electronegativity, which can increase the intermolecular forces and improve the corrosion resistance and chemical stability of the material. The introduction of phenyl groups can enhance the rigidity and thermal stability of the polymer, thereby improving its corrosion - resistant performance.

Add antioxidants: Add an appropriate amount of antioxidants, such as hindered phenols and thioesters, to the organic polysilazane. These antioxidants can capture free radicals and prevent oxidation reactions, thus improving the corrosion resistance of the material in high - temperature and humid environments.
Add corrosion inhibitors: Incorporate some corrosion inhibitors, such as organic amines and azole compounds. They can form a protective film on the chip surface, preventing corrosive media from contacting the chip and thus playing a corrosion - inhibiting role.

Select a suitable curing agent: Choose a suitable curing agent according to the structure and performance requirements of the organic polysilazane. Different curing agents have different reaction activities with the polymer, which will affect the cross - linking density and network structure after curing. For example, selecting a curing agent containing multiple reactive groups can increase the cross - linking density and enhance the corrosion resistance of the material.
Optimize the curing conditions: Precisely control the curing temperature, time, and pressure. Moderately increasing the curing temperature can accelerate the curing reaction, but an excessively high temperature may cause internal stress or degradation of the material. Prolonging the curing time can make the curing reaction more complete and increase the cross - linking density, but an overly long time will affect production efficiency.

Electroless plating: Conduct electroless plating on the chip surface, such as nickel plating or copper plating. The metal coating can act as a barrier to prevent corrosive media from contacting the organic polysilazane and the chip, and it can also improve the thermal conductivity of the chip.
Plasma treatment: Use plasma technology to treat the chip surface and introduce some active groups, such as hydroxyl and carboxyl groups, on the surface. These groups can react with the organic polysilazane, improving the adhesion between the coating and the chip surface and thus enhancing the corrosion resistance.

Adopt multi - layer packaging: Design a multi - layer packaging structure by combining organic polysilazane with other materials with good corrosion resistance, such as polyimide and epoxy resin. Different materials can complement each other to form a more comprehensive protection system and improve the overall corrosion - resistant performance.
Optimize the packaging thickness: Reasonably adjust the thickness of the organic polysilazane packaging layer according to the usage environment and requirements of the chip. Appropriately increasing the thickness can improve the protection performance, but it will also increase the cost and process difficulty. It is necessary to determine the optimal packaging thickness through experiments and simulation analysis.