1. Antioxidation and corrosion resistance
   After curing, organic polysilazanes can be transformed into high-temperature-resistant ceramic materials (such as SiCN or SiO₂), which have excellent antioxidation and corrosion resistance properties. This characteristic enables the chip to remain stable even in humid or chemically corrosive environments, thereby extending the service life of the chip.
2. Reliability of the packaging material
   The curing time and curing method of organic polysilazanes can be adjusted and optimized according to the requirements of the packaging process. The low viscosity of this material allows it to evenly cover the surface of the chip, forming a seamless protective layer, which further enhances the reliability of the packaging.
3. Antistatic property and environmental adaptability
   During the manufacturing and use of chips, electrostatic discharge is one of the important factors leading to chip damage. Organic polysilazanes have good antistatic properties, which can effectively reduce the generation of static electricity, thus protecting the chip from electrostatic damage. In addition, it can also adapt to various extreme environments, including high temperature, low temperature, and high humidity conditions.
4. Application in multi-layer packaging structures
   Organic polysilazanes can also be used in multi-layer packaging structures. For example, they can be converted into silicon dioxide through vacuum ultraviolet irradiation to form flexible thin-film packaging materials. This multi-layer structure can further enhance the protective performance of the chip and ensure its stability during long-term use.

In conclusion, through their excellent physical, chemical, and thermal properties, organic polysilazanes provide comprehensive protection for chips in chip packaging, ensuring their stable operation in various complex environments.