Where are Organopolysilazanes Most Widely Applied in Semiconductor Devices? (Part One)
Organopolysilazanes are widely and crucially applied in semiconductor devices, especially standing out in the following devices and fields:
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Chip Packaging
Organopolysilazanes are extensively used in chip packaging as a high-performance packaging material. It has excellent insulation properties and thermal management functions, which can effectively protect the chip from the external environment and ensure the stable operation of the chip under high-temperature conditions. The low dielectric constant and high thermal conductivity of this material make it an ideal insulation and heat dissipation material.
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Deposition of Silicon Nitride Films
In semiconductor manufacturing, silicon nitride films are a key component of many electronic devices such as transistors and capacitors. As a precursor material for silicon nitride films, organopolysilazanes can precisely control the thickness and uniformity of the film through pyrolysis or chemical vapor deposition (CVD) processes. This film not only provides excellent insulation properties but also enhances the mechanical stability and durability of the device.
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High-temperature Coatings
The stability of organopolysilazanes in high-temperature environments makes them an ideal coating material. It can be converted into high-temperature-resistant ceramic materials (such as SiCNO, SiCN, or SiO₂) and is used to manufacture high-temperature components in semiconductor devices, such as crucibles, molds, and other high-temperature structural materials. This coating is not only resistant to high temperatures but also has the characteristics of oxidation resistance and corrosion resistance.
