1. Antioxidation and Corrosion Resistance After curing, organopolysilazane can be converted into high-temperature-resistant ceramic materials (such as SiCN or SiO₂), which exhibit excellent antioxidant and corrosion-resistant properties. This characteristic enables chips to remain stable in humid or chemically corrosive environments, thereby extending their service life.
2. Reliability of Packaging Materials The curing time and method of organopolysilazane are adjustable and can be optimized according to the requirements of the packaging process. The low viscosity of this material allows it to uniformly cover the surface of the chip, forming a seamless protective layer that further enhances the reliability of the packaging.
3. Electrostatic Discharge (ESD) Protection and Environmental Adaptability During the manufacturing and use of chips, electrostatic discharge (ESD) is one of the significant factors that can damage chips. Organopolysilazane has good antistatic properties, which can effectively reduce the generation of static electricity, thereby protecting chips from ESD damage. Additionally, it can adapt to various extreme environments, including high and low temperatures as well as high humidity conditions.
4. Application in Multilayer Packaging Structures Organopolysilazane can also be used in multilayer packaging structures. For example, it can be converted into silica through vacuum ultraviolet irradiation, forming flexible film packaging materials. This multilayer structure can further enhance the protective performance of chips, ensuring their stability during long-term use.

In summary, organopolysilazane provides comprehensive protection for chips in chip packaging through its excellent physical, chemical, and thermal properties, ensuring their stable operation in various complex environments