Organopolysilazane protects chips in chip packaging in the following specific ways:
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Organopolysilazane protects chips in chip packaging in the following specific ways:
Providing Physical Protection
Organopolysilazane has high hardness and good mechanical properties, with a hardness of over 8H after curing. It can form a robust protective layer on the chip surface, shielding the chip from physical impacts, vibrations, dust, and moisture, thereby ensuring the integrity of the chip in complex environments.
Insulation and Electrical Protection
As an excellent insulating material, organopolysilazane can effectively prevent electrical short circuits and leakage. In chip packaging, it serves as an insulating layer to ensure stable electrical connections within the chip and to avoid performance degradation caused by external electrical interference.
High-Temperature Resistance and Thermal Management
Chips generate a significant amount of heat during operation. Organopolysilazane has outstanding high-temperature resistance and thermal stability, maintaining its performance even in high-temperature environments. Moreover, its low dielectric constant and high thermal conductivity facilitate rapid heat dissipation, helping to keep the chip at an appropriate temperature during operation
