What is the thermal stability of organic polysilazane?
Organic polysilazane has good thermal stability, and its specific manifestations are as follows:

• Stable structure at high temperatures: The main chain of organic polysilazane consists of alternating silicon (Si) and nitrogen (N) atoms. The bond energy of the Si - N bond is relatively high, generally between 300 - 330 kJ/mol. This makes it difficult to break in high - temperature environments and enables it to maintain the integrity of its molecular structure. For example, within the temperature range of 200 - 300 °C, the mass loss of organic polysilazane is small, and its molecular structure basically does not change significantly.
• Conversion into high - temperature - resistant ceramic phases: At high temperatures, organic polysilazane undergoes reactions such as cross - linking and cyclization, and can ultimately be converted into high - temperature - resistant ceramic phases, such as SiCN and Si₃N₄. These ceramic phases have higher thermal stability and high - temperature resistance and can be used in high - temperature environments above 1000 °C for a long time. For instance, when organic polysilazane is heat - treated at 1000 - 1500 °C in a nitrogen atmosphere, a dense SiCN ceramic can be obtained. This ceramic can still maintain good mechanical and chemical stability at a high temperature of 1400 °C.
• High thermal decomposition temperature: The thermal decomposition temperature of organic polysilazane is usually between 350 - 450 °C, which is much higher than that of many organic polymer materials. This means that under normal chip operating temperatures and conventional processing temperatures, organic polysilazane can remain stable without thermal decomposition that would affect its performance.

The above data are for reference only. The thermal stability of organic polysilazanes with different structures and formulations may vary. 分享 有机聚硅氮烷的热稳定性在实际应用中有哪些优势？ 如何进一步提高有机聚硅氮烷的热稳定性？ 热稳定性良好的有机聚硅氮烷有哪些应用领域？