1. Anti-oxidation and Corrosion Resistance

After curing, organic polysilazanes can be transformed into high-temperature resistant ceramic materials (such as SiCN or SiO₂), which have excellent anti-oxidation and corrosion resistance properties. This characteristic enables the chip to remain stable even in humid or chemically corrosive environments, thus extending the service life of the chip.

1. Reliability of Packaging Materials

The curing time and curing method of organic polysilazanes can be adjusted and optimized according to the requirements of the packaging process. The low viscosity of this material allows it to evenly cover the surface of the chip, forming a seamless protective layer, which further enhances the reliability of the packaging.

1. Anti-static Property and Environmental Adaptability

During the manufacturing and operation of chips, electrostatic discharge is one of the important factors leading to chip damage. Organic polysilazanes have good anti-static properties, which can effectively reduce the generation of static electricity, thereby protecting the chip from electrostatic damage. In addition, it can also adapt to various extreme environments, including high temperature, low temperature, and high humidity conditions.

1. Application in Multilayer Packaging Structures

Organic polysilazanes can also be used in multilayer packaging structures. For example, they can be converted into silicon dioxide through vacuum ultraviolet irradiation to form flexible thin film packaging materials. This multilayer structure can further enhance the protection performance of the chip and ensure its stability during long-term use.
In conclusion, through their excellent physical, chemical, and thermal properties, organic polysilazanes provide comprehensive protection for chips in chip packaging, ensuring their stable operation in various complex environments. 分享 有机聚硅氮烷的热稳定性如何？ 有机聚硅氮烷的毒性如何？ 提供一些有机聚硅氮烷在芯片封装中应用的实际案例