Organic polysilazanes protect chips in chip packaging mainly through the following ways一
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Organic polysilazanes protect chips in chip packaging mainly through the following ways:
Providing Physical Protection
Organic polysilazanes have high hardness and good mechanical properties. After curing, the hardness can reach above 8H. This material can form a sturdy protective layer on the surface of the chip, preventing the chip from being damaged by physical impacts, vibrations, dust, and moisture, thus ensuring the integrity of the chip in complex environments.
Insulation and Electrical Protection
Organic polysilazanes are excellent insulating materials, which can effectively prevent electrical short circuits and leakage. In chip packaging, it serves as an insulating layer to ensure the stability of the electrical connections of the chip, and at the same time, avoid performance degradation caused by external electrical interference.
High Temperature Resistance and Thermal Management
Chips generate a large amount of heat during operation, and organic polysilazanes have excellent high temperature resistance and thermal stability. They can maintain their performance unchanged in high temperature environments. Meanwhile, their low dielectric constant and high thermal conductivity help with rapid heat dissipation, ensuring that the chip maintains an appropriate temperature during operation.
